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產品介紹
The ER-X series offers an airless charge removal capability to eliminate the need for compressed air in addition to low pressure and high speed compressed air based modes. By applying a compressed air source, the ion volume increases providing an improved tact time for substrate ionization. This makes the ER-X suitable for applications such as electronic paper and thin film solar cells, where charge removal time is directly linked to productivity. The ER-X series works extremely well for charge removal applications. The ER-X series can effectively remove surface charges with an air pressure of less than 0.05 MPa.Three features for diverse application coverage
Furthermore, it supports dual-head confi gurations for expanded application coverage.Fast Charge Removal
Massive ion discharge when using air reduces charge removal time.
Airless or Low-Pressure
Resolves target movement issues in the presence of compressed air.
Precision substrates like laminated film and lead frames, as an example, may become unseated or shifted due to the presence of a compressed air source. The absence of compressed air during ionization facilitates smooth operation while efficiently removing surface charges.Low-Pressure (Air pressure:Less than 0.05MPa)
Prevents dust dispersion and cleanliness degradation!
With the advantage of minimal dust dispersion, it is suitable for charge removal in semiconductor, FPD (mobile panel), and other applications that require high degree of cleanliness. The presence of air also helps prevent adhesion of dust to the discharge needles, requiring less cleaning than in the airless charge removal mode.
